News about HBM

Samsung Electronics is reportedly working with TSMC to use TSMC's 3nm process to produce base dies for Nvidia's next-generation custom HBM chips, according to the Seoul Economic Daily, marking the first time Samsung has collaborated with TSMC at the HBM manufacturing stage. The base die integrates the memory controller previously housed on the GPU, and together with a 60% smaller physical layer, it is said to deliver up to 30% more memory bandwidth and 15% lower power consumption than standard HBM4E. Sources cited TSMC's yield on this process at over 90%, versus about 60% for Samsung's comparable 2nm process, supporting consolidation of production at TSMC. Demand is rising, with UBS projecting about 61.5 billion gigabits of HBM needed next year, up 91%, while supply is expected to fall short by about 10%.