News about Foxconn

Chairman Young Liu of Hon Hai (Foxconn) told CNBC the company could raise its share of the global AI server market from around 40% today to 50% within a couple of years, and to about 45% next year. He expects AI infrastructure to make up 60% to 65% of Foxconn's revenue over the next three to five years, excluding edge AI devices. Production capacity is already fully booked for at least the next year and a half, with current demand coming mainly from AI model developers and cloud providers. Foxconn plans to expand U.S. manufacturing, starting with higher-margin products such as AI server racks and data center equipment, because U.S. production costs are higher. Liu warned that "overinvestment will kill the company" and said AI spending could exceed the planned $3 billion to $5 billion a year, depending on how far vertical integration goes.

At the 7th annual Hon Hai Tech Day 2026 (HHTD26), Hon Hai Technology Group (Foxconn, TWSE: 2317) showcased its vertical integration and precision manufacturing for next-generation AI infrastructure built around the NVIDIA Vera Rubin platform. The event featured a record 321 exhibits, with about a quarter in the Token Factory zone, including a 20-meter wall of PCBs and components and a cable-free, hose-free, fanless AI server compute tray. Foxconn also unveiled NVIDIA DSX POD, a factory-built reference design that lets partners pre-integrate Vera Rubin rack-scale systems in modular containers, validate them before shipment, and connect them to site infrastructure after delivery. Chairman Young Liu said Foxconn is transforming into a technology manufacturing platform provider spanning smart consumer electronics, AI, EVs, space and robotics. Foxconn's AI supercomputing and cloud operations unit is also planning facility design under NVIDIA DSX MaxLPS principles to maximize AI factory performance per watt.

Apple has reportedly asked suppliers to increase iPhone Duo orders by 30% after demand exceeded initial stock, according to a Monday report by Taiwan's Economic Daily citing industry sources. The foldable device went on sale globally on Friday and reportedly sold out almost immediately, with the next round of shipments not expected to begin until 22 January. Estimated shipments for this year have reportedly risen from about 6 million units to between 8 million and 10 million, and the report projects 33 million units by 2027, though that is a projection rather than a confirmed target. Foxconn assembles the device and TSMC makes its main processor, and the iPhone Duo is priced well above comparable foldables from Samsung and Google. The report did not disclose the size of the initial inventory, so the sell-out does not reveal total purchase volume.