Citing supply-chain sources, Taiwan's China Times reported that TSMC is preparing to raise advanced packaging prices by 10%–20% as surging AI chip demand strains capacity. The increase could raise costs for Nvidia (NVDA) and AMD and add pressure on the prices of Apple's (AAPL) iPhones and MacBooks. Demand for CoWoS packaging is expanding beyond GPUs to server CPUs and custom AI chips, with monthly capacity expected to exceed 130,000 units in 2026 and 200,000 units next year. TSM hit a record high on Oct. 5 but has since been caught in an AI-stock selloff, though it is still up 40.5% year to date. NVDA has fallen about 11% from its Oct. 6 record close but is up 16% year to date, while retail sentiment on Stocktwits was bullish for NVDA and AMD and bearish for TSM.
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TSMCsemiconductorssupply chainNVDA
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Related tickers and likely impact
NVDA
▼ Likely negativeNvidia
Relevance: medium
| Market | US stocks |
|---|---|
| Sector | Information Technology |
| Industry | Semiconductors |
| Market cap | $5.1T |
| Close on 10/26/2026 | 215.98 |
| Change that session | +2.38% |
AAPL
▼ Likely negativeApple Inc.
Relevance: low
| Market | US stocks |
|---|---|
| Sector | Information Technology |
| Industry | Technology Hardware, Storage & Peripherals |
| Market cap | $5.1T |
| Close on 10/26/2026 | 343.98 |
| Change that session | -1.08% |
Impact is scored by AI from the headline and may be wrong. It is not investment advice.
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